|
--Main Products： |
|
|
| |
|
|
|
 |
--Microwave Dielectric Ceramic |
|
|
| |
   |
|
| |
Application： SLC, Resonator, Antenna. |
|
| |
|
|
|
|
--Dielectric Ceramic Substrate |
|
|
| |
|
|
| |
Application：Thin Film, Thick Film, Chip Resistors,Chip Capacitors, Heat Sink, SLC. |
|
| |
|
|
|
|
--Dielectric Ceramic Resonator |
|
|
| |
   |
|
| |
Application：Dielectric duplexers, Fliter. |
|
| |
|
|
|
|
--Microwave Ferrite Substrate |
|
|
| |
|
|
| |
Application：Circulator, Isolater, Phase Shifter. |
|
| |
|
|
|
|
--Microwave Part |
|
|
| |
|
|
| |
Application：The basic unit comprised of microwave \ millimeter wave modules. |
|
| |
|
|
|
|
--Microwave Component |
|
|
| |
|
|
| |
Application：Filter, Attenuators, Couplers, Differentiator, Verifier, Circulator, Isolating device. |
|
| |
|
|
|
|
--AuSu Alloys Solder Foil |
|
|
| |
|
|
| |
Application：
Au80Sn20 pre-forms, one of the typical Au-based precious metals solder, is suitable for high reliability requirements of optoelectronic and microelectronic packaging for its good oxidation and creep resistance, fine wetting ability, high welding joints strength and thermal conductivity. |
|
| |
|
|
|
|
--Submount / Standoff |
|
|
| |
|
|
| |
Application：Heat dissipation, Position matching |
|
| |
|
|
|
|
--New Product |
|
|
| |
 |
|
| |
--Ceramic Connector |
|
| |
|
|
| |
|
|
| |
--Ceramic Packages |
|
| |
|
|
|
